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New Espressif Products Coming Soon

Shanghai, China
Sep 1, 2017

New ESP32-based products to be released soon!

The ESP32-PICO-D4 is a System-in-Package (SiP) that is based on ESP32, supporting both Wi-Fi and Bluetooth connectivity, yet avoiding bulky quad-flat no-leads (QFN) packages. The module’s dimensions are only 7.0 × 7.0 × 0.94 mm, which means that it requires minimal PCB area, while integrating a 4 MB SPI flash, a crystal oscillator and most of the decoupling caps. This “makes life a lot easier and reduces via and component count”, as IoTbits acknowledges.

 

Additionally, ESP32-PICO-D4 integrates peripheral components, such as filter capacitors and RF matching links in a single package. Given that no other peripheral components are involved, module welding and testing are not required either. This way, ESP32-PICO-D4 reduces the complexity of supply chain and improves control efficiency even further. At the core of this module is the ESP32 chip, our flagship dual-core 2.4 GHz Wi-Fi+Bluetooth combo chip, which has been designed with TSMC’s ultra-low-power (40 nm) technology.

With its small size, robust performance and low-energy consumption, ESP32-PICO-D4 is an ideal solution for wearable electronics and other space-constrained applications.

ESP32-PICO-D4 SiP specifications:

  • SoC: ESP32 with two Tensilica LX6 cores, 448 KB ROM, 520 KB SRAM (inc. 8 KB RTC memory), 1 kbit eFuse
  • On-module Flash: 4 MB SPI flash
  • Wi-Fi Connectivity: 802.11 b/g/n/e/i (802.11n up to 150 Mbps)
  • Bluetooth Connectivity:
    • Bluetooth V4.2 BR/EDR and Low Energy;
    • class-1, class-2 and class-3 transmitters;
    • Audio: CVSD and SBC
  • SD card, UART, SPI, SDIO, LED PWM, Motor PWM, I2S, I2C, IR, GPIO, capacitive touch sensor, ADC, DAC, LNA pre-amplifier
  • Sensors: On-chip Hall sensor and temperature sensor
  • Clock: On-module 40 MHz crystal
  • Power supply: 2.3 to 3.6V
  • Operating current: 80 mA (average)
  • Temperature range: -40°C to 85°C
  • Package dimensions: 7.0±0.1 mm × 7.0±0.1 mm × 0.94±0.1 mm

On a different note, the ESP32-S0WD chip is also a member of the ESP32 series, which has been designed to achieve the best power and RF performance, with robustness, versatility, and reliability in a wide variety of applications. The distinctness of ESP32-S0WD is based on the fact that it features a single core, while maintaining the combination of Wi-Fi and Bluetooth connectivity. 

It is also compatible with all the peripherals of its dual-core 2.4 GHz counterpart that has been designed with TSMC’s ultra-low-power 40nm technology. Available in a 5 × 5 mm QFN package, ESP32-S0WD offers great value for money, as its performance remains solid even when powering complex IoT applications. 

ESP32-S0WD specifications:

  • SoC: ESP32 with a single-core, low-power Xtensa 32-bit LX6 microprocessor
  • 448 KB of ROM for booting and core functions
  • 520 KB of on-chip SRAM for data and instructions
  • 16 KB of SRAM in RTC
  • QSPI flash/SRAM up to 4 × 16 MB
  • Connectivity: Bluetooth (Classic & Low-Energy) + Wi-Fi b/g/n dual mode
  • Power supply: 2.3V to 3.6V
  • SPI, I2S, I2C, SDIO, UART, IR, PWM
  • Temperature sensor, touch sensor, ADC, DAC
  • News
    2019.09.10
    Recently 3 vulnerabilities have been disclosed related to ESP8266 & ESP32 Wi-Fi features, particularly WPA2 Enterprise:Zero PMK Installation (CVE-2019-12587), EAP Client Crash (CVE-2019-12586) and Beacon Frame crash (CVE-2019-12588).
  • News
    2019.09.03
    An attacker who uses fault injection to physically disrupt the ESP32 CPU can bypass the Secure Boot digest verification at startup and boot unverified code from flash. To protect devices with Flash Encryption and Secure Boot enabled against this attack, a firmware change must be made to permanently enable Flash Encryption in the field.
  • News
    2019.09.03
    ESP32-S2 is a highly integrated, low-power, 2.4 GHz Wi-Fi Microcontroller supporting Wi-Fi HT40 and having 43 GPIOs. Based on an Xtensa® single-core 32-bit LX7 processor, ESP32-S2 can be clocked at up to 240 MHz.