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Upgrading the label format, updating KCC ID for ESP32-WROOM-32D and filling the thermal pad with solder mask for ESP32-WROOM-32D & ESP32-WROOM-32U |
PCN-2021-009 |
2021.04.10 |
2021.04.25 |
2021.04.25 |
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Shield Cover Marking Change for ESP Modules |
PCN-2021-008 |
2021.03.16 |
2021.03.19 |
2021.03.23 |
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Introducing TH25Q-16HB-MSCI as an Alternative 16 Mb Flash for ESP8266 Module Series |
PCN-2021-001 |
2021.01.11 |
2021.01.11 |
2021.04.11 |
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Introducing XM25QH32CHPGT10Q-03000 as an Alternative 32Mb Flash for ESP32 high temperature (105°C) Module Series |
PCN-2020-018 |
2020.12.01 |
2020.12.01 |
2021.03.01 |
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KCC Certification ID and Identification Changes for ESP32-WROOM-32/32D/32U, ESP32-WROVER-B/IB, ESP32-SOLO-1, and ESP-WROOM-02/02U Modules |
PCN-2020-017 |
2020.11.17 |
2020.11.16 |
2020.12.16 |
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Changes of the marking on ESP32-WROVER-E and ESP32-WROVER-IE to add new certification identification |
PCN-2020-016 |
2020.11.06 |
2020.10.28 |
2021.01.28 |
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Introduction of AT firmware V2.1.0.0 as the first published AT firmware for ESP32-S2 series Modules and DevKits |
PCN-2020-014 |
2020.09.11 |
2020.09.11 |
2020.12.11 |
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Change of module from ESP32-WROVER-B to ESP32-WROVER-E on ESP32-LyraT, ESP32-LyraTD- MSC, and ESP32-LyraT-Mini |
PCN-2020-013 |
2020.08.28 |
2020.08.28 |
2020.11.28 |
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Introduction of 40 MHz Faith Long Crystal Oscillator as an Alternate Source for High Temperature (105°C) ESP32 and ESP32-S2 Module Series |
PCN-2020-011 |
2020.08.28 |
2020.08.28 |
2020.11.28 |
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Strengthening the ESP8266/ESP32/ESP32-S2 Module Series Tape Reel by Embossing Cross Patterns at the Bottom of each Tray |
PCN-2020-008 |
2020.08.17 |
2020.08.17 |
2020.09.14 |
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Introducing BY25Q64ASTIG as an Alternative 64Mb Flash for ESP32 Module Series |
PCN-2020-010 |
2020.08.06 |
2020.08.07 |
2020.11.07 |
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Introducing XM25QH128CHIQT08Q as an Alternative Flash for ESP32-WROOM-32UE and ESP32-WROOM-32 |
PCN-2020-009 |
2020.08.06 |
2020.08.15 |
2020.08.31 |
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Introduction of Flash Part Number XM25QH128CHIQT08Q as Main Source for ESP32 Series Modules |
PCN-2020-007 |
2020.07.01 |
2020.07.01 |
2020.07.10 |
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Add NittoEM-350 as the alternative DAF material for ESP32-PICO-D4 |
PCN-2020-006 |
2020.06.16 |
2020.06.16 |
2020.09.15 |
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Flash Part Number Change for ESP8266, EPS32, ESP32-S2 Modules Series |
PCN-2020-005 |
2020.05.21 |
2020.05.21 |
2020.06.18 |
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ESP8266 modules AT bin upgrade to V1.7.3 |
PCN-2020-004 |
2020.04.26 |
2020.04.26 |
2020.07.16 |
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ESP8266EX Chip Datasheet Amendments |
PCN-2020-003 |
2020.03.31 |
2020.04.01 |
2020.04.02 |
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ESP8285 Series Chip Datasheet Amendments |
PCN-2020-002 |
2020.03.31 |
2020.04.01 |
2020.04.02 |
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ESP32-WROVER-B Datasheet Amendments |
PCN-2020-001 |
2020.03.18 |
2020.03.23 |
2020.04.01 |
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Introducing ASE as a new ATM plant for ESP8266EX |
PCN-03-20200120 |
2020.02.07 |
2020.02.05 |
2020.03.10 |
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Flash and DAF Change for ESP8285N08 and ESP8285H08 |
PCN-03-20191017 |
2019.12.17 |
2019.11.17 |
2019.12.17 |
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Adding a QR code to the shielding case of ESP-WROOM-02/ESP32-WROOM-32/ESP32-WROVER |
PCN-03-2019120301 |
2019.12.02 |
2020.12.05 |
2020.02.20 |
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ESP32 Series Products Technical Document Change |
PCN-02-20190815 |
2019.11.01 |
2019.11.01 |
2019.11.01 |
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Add a new Assembly and Test Manufacturing (ATM) plant for ESP8285 Series of Chips |
PCN-03-20190917 |
2019.10.08 |
2019.10.08 |
2020.01.01 |
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ESP8266 Series Chip Product Technical Document Change |
PCN-02-20190716 |
2019.08.01 |
2019.07.16 |
2019.08.01 |
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Add a 6-bit Code on Labels of all Modules to Indicates its Operating Temperature and Flash Size (International version) |
PCN-03-2019070102 |
2019.07.12 |
2019.07.12 |
2019.07.15 |
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Add a 6-bit Code on Labels of all Modules to Indicates its Operating Temperature and Flash Size (China domestic version) |
PCN-03-2019070101 |
2019.07.12 |
2019.07.12 |
2019.07.15 |
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ESP8285 Datasheet Change |
PCN-04-20190625 |
2019.06.25 |
2019.08.25 |
2019.08.28 |
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QR CODE INFORMATION CHANGE FOR ESP32-WROVER-B MODULES |
PCN-03-2019060501 |
2019.06.12 |
2019.06.12 |
2019.06.19 |
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Espressif Chip Product Packing Label Format Change |
PCN-03-20190510 |
2019.06.03 |
2019.05.27 |
2019.06.03 |
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Espressif Chip Product Cover Tape Material Change |
PCN-03-20190524 |
2019.05.24 |
2019.06.01 |
2019.06.14 |
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Upgrading AT Firmware for ESP32 Modules |
PCN-03-2019011001 |
2019.04.10 |
2019.01.10 |
2019.04.10 |
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Packaging Changes to Espressif Modules |
PCN-03-20190215 |
2019.03.08 |
2019.02.15 |
2019.03.08 |
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AT Bin Version Upgrade For ESP8266 Modules |
PCN-03-2018112601 |
2019.01.26 |
2018.11.26 |
2019.01.26 |
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Updating the Datasheets of the ESP32 Series of Products |
PCN-03-20190121 |
2019.01.21 |
2019.01.21 |
2019.01.21 |
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AT BIN UPGRADE FOR ESP32 SERIES MODULE |
PCN-03-2018083001 |
2018.11.30 |
2018.08.30 |
2018.11.30 |
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Add a new Assembly and Test Manufacturing (ATM) plant for ESP32-D0WD and ESP32-S0WD |
PCN-03-20180810 |
2018.11.20 |
2018.08.20 |
2018.11.20 |
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Adding a new second Fabrication Plant For Module Family |
PCN-03-201800921 |
2018.11.18 |
2018.09.18 |
2018.11.18 |
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Adding a Second Fabrication Plant for Espressif Modules |
PCN-03-20180813 |
2018.11.13 |
2018.08.13 |
2018.11.13 |
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Updating the Operating Temperature Information in the ESP32-WROVER Datasheet and Changing the C18 Capacitor |
PCN-03-201800921 |
2018.11.06 |
2018.11.06 |
2018.12.06 |
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Notice of Customized China Label for All Espressif Modules |
PCN-03-201800921 |
2018.10.19 |
2018.10.12 |
2018.10.19 |
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