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Title PCN No. Released Date Proposed Date of Change Proposed Date of First Shipment Download
Introduction of Flash Part Number XM25QH128CHIQT08Q as Main Source for ESP32 Series Modules PCN-2020-007 2020.07.01 2020.07.01 2020.07.10
Add NittoEM-350 as the alternative DAF material for ESP32-PICO-D4 PCN-2020-006 2020.06.16 2020.06.16 2020.09.15
Flash Part Number Change for ESP8266, EPS32, ESP32-S2 Modules Series PCN-2020-005 2020.05.21 2020.05.21 2020.06.18
ESP8266 modules AT bin upgrade to V1.7.3 PCN-2020-004 2020.04.26 2020.04.26 2020.07.16
ESP8266EX Chip Datasheet Amendments PCN-2020-003 2020.03.31 2020.04.01 2020.04.02
ESP8285 Series Chip Datasheet Amendments PCN-2020-002 2020.03.31 2020.04.01 2020.04.02
ESP32-WROVER-B Datasheet Amendments PCN-2020-001 2020.03.18 2020.03.23 2020.04.01
Introducing ASE as a new ATM plant for ESP8266EX PCN-03-20200120 2020.02.07 2020.02.05 2020.03.10
Flash and DAF Change for ESP8285N08 and ESP8285H08 PCN-03-20191017 2019.12.17 2019.11.17 2019.12.17
Adding a QR code to the shielding case of ESP-WROOM-02/ESP32-WROOM-32/ESP32-WROVER PCN-03-2019120301 2019.12.02 2020.12.05 2020.02.20
ESP32 Series Products Technical Document Change PCN-02-20190815 2019.11.01 2019.11.01 2019.11.01
Add a new Assembly and Test Manufacturing (ATM) plant for ESP8285 Series of Chips PCN-03-20190917 2019.10.08 2019.10.08 2020.01.01
ESP8266 Series Chip Product Technical Document Change PCN-02-20190716 2019.08.01 2019.07.16 2019.08.01
Add a 6-bit Code on Labels of all Modules to Indicates its Operating Temperature and Flash Size (International version) PCN-03-2019070102 2019.07.12 2019.07.12 2019.07.15
Add a 6-bit Code on Labels of all Modules to Indicates its Operating Temperature and Flash Size (China domestic version) PCN-03-2019070101 2019.07.12 2019.07.12 2019.07.15
ESP8285 Datasheet Change PCN-04-20190625 2019.06.25 2019.08.25 2019.08.28
QR CODE INFORMATION CHANGE FOR ESP32-WROVER-B MODULES PCN-03-2019060501 2019.06.12 2019.06.12 2019.06.19
Espressif Chip Product Packing Label Format Change PCN-03-20190510 2019.06.03 2019.05.27 2019.06.03
Espressif Chip Product Cover Tape Material Change PCN-03-20190524 2019.05.24 2019.06.01 2019.06.14
Upgrading AT Firmware for ESP32 Modules PCN-03-2019011001 2019.04.10 2019.01.10 2019.04.10
Packaging Changes to Espressif Modules PCN-03-20190215 2019.03.08 2019.02.15 2019.03.08
AT Bin Version Upgrade For ESP8266 Modules PCN-03-2018112601 2019.01.26 2018.11.26 2019.01.26
Updating the Datasheets of the ESP32 Series of Products PCN-03-20190121 2019.01.21 2019.01.21 2019.01.21
AT BIN UPGRADE FOR ESP32 SERIES MODULE PCN-03-2018083001 2018.11.30 2018.08.30 2018.11.30
Add a new Assembly and Test Manufacturing (ATM) plant for ESP32-D0WD and ESP32-S0WD PCN-03-20180810 2018.11.20 2018.08.20 2018.11.20
Adding a new second Fabrication Plant For Module Family PCN-03-201800921 2018.11.18 2018.09.18 2018.11.18
Adding a Second Fabrication Plant for Espressif Modules PCN-03-20180813 2018.11.13 2018.08.13 2018.11.13
Updating the Operating Temperature Information in the ESP32-WROVER Datasheet and Changing the C18 Capacitor PCN-03-201800921 2018.11.06 2018.11.06 2018.12.06
Notice of Customized China Label for All Espressif Modules PCN-03-201800921 2018.10.19 2018.10.12 2018.10.19




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